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OLED Encapsulation

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  Organic light emitting diodes require moisture barrier layers to protect them from oxidative species such as moisture and oxygen because of the high sensitivity of organic materials and high work function metals. In early days, the encapsulation was achieved by using a cover glass or metal can in an inert gas such as nitrogen or argon. The edge of display is sealed with UV-cured epoxy resin. However, it has a critical limitation for flexibility due to the rigidity of substrates and lids. Recently, the display and lighting markets are moving toward foldable and flexible devices. Flexible OLEDs are defined as lighter, thinner, more durable and flexible devices, comparing to OLEDs with glass substrate currently utilized. So the development of flexible OLEDs technology, which has the future potential of ultrathin, rollable, and additional properties, is attracting more attention as the next generation OLED technology. To realize the flexible OLEDs, thin film encapulation is considered indispensable for future flexible electornics.

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